NEPCON - 2008
Eastec

Die Placement and Rework

Semiconductor Equipment Corp

Assembly Products is the authorized technical sales representative for Semiconductor Equipment's Die Placement and Rework systems in the six New England states.

Links

SEC website

Featured Products

I-Cube The i-CUBE II is a high-speed, automatic die bonder capable of mixed mounting SMD components and semiconductor components as well as handling multiple types of components. It is usable for dipping and stamping by the dipping unit, and it is applicable for dispensing and for a wide area up to L300mm X W200mm. The i-Cube II can be used either as a stand-alone unit or inline.
860 Eagle is a multi-use semiautomatic system ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, eutectic bonding including laser diodes and bars and epoxy bonding. Some of the process capabilities that support these applications are ultrasonic, thermosonic, scrub, flux dipping and hot gas spot heating. The new system is designed for maximum versatility and ease of operation.860 Eagle